The problem: manufacturers provide a lot of information on the operation and characteristics of the devices, but not on what's inside.
I'm trying to incorporate the effects of a surface mount PIN diode in a full wave electromagnetic simulation. The only problem is that there is a portion of doped and undoped silicon in the diode, only I don't know how much.
It's apparent that the pads on the device packaging will likely dominate the interactions due to the diode, but the simulation is for a sensitive device so if possible I'd like to include all electrically active components.
Are there any experts out there who know roughly how much of these surface mount devices are doped / undoped semiconductor compared to the packaging? (the specific diode in this case is the SOD-882 from the SMP 1322 series, Skyworks)
Thanks in advance.