I want to connect a mobile processor such as a Samsung Exynos or Qualcomm Snapdragon, which both have their connectors on the bottom to a PCB but im not sure if this is something i can do on my own or needs a pick and place machine, to be honest im not entirely sure what the method of soldering used is called. Can you please inform me if a socket is available for these also? Sorry if this came across as a dumb question, thanks for the help :)
It is not possible to solder components with contacts on the bottom (called Ball Grid Array, or BGA) using a soldering iron. You would need either a reflow oven, or a BGA rework station.
Some people do have reflow ovens at home, or have converted toaster ovens to do the job, but even then it's a bit tricky and easy to mess up.
So the answer to your question is yes, you can do this at home if you have the right tools, but if you only have a soldering iron then you can't.
Is it practical or is it going to work, especially in an 1000+ balls device?
I don't think so...
(Image from the comments area from Hackaday website)