In my board, all 0402 parts are using gang solder mask.
The pad to pad distance is 10 mils. Is there any risk of solder short?
Do I need to suggest applying solder mask web between the pads for all 0402?
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Mentor Graphics LP viewer based on IPC has the nominal pad edges just 0.39 mm apart for a RESC1005X40N. Our normal target is a 0.1 mm gap for copper pad to the resist, I reduced this to 0.0957 mm for my 0402 to maintain a 0.2 mm resist sliver.
Just my solution of course.