I used to work at this electronics assembly plant in Arizona, and the machines there used reels of SMT parts that were like a bucketed plastic ribbon with a peel-off plastic seal. I don't know what those are called; most of them held tiny pieces of the basic elements of circuitry. Occasionally though I saw some moderately sized BGA chips and the like, eg. Xilinx chips that came in these ribbons as well. I'm curious if Intel sells ribbons like that filled with 6700K chips or something, probably to Dell or some other manufacturer. How about AMD selling ribbons of say G-Series SOCs, or any other massive chips or parts that are sold in literal reels?
14.6 Handling: Shipping Media 14.6.1 Mid-temperature Thin Matrix Tray The BGA packages are shipped in either a tape and reel or a mid-temperature thin matrix tray that complies to the JEDEC standards. Typically, JEDEC trays have the same ‘x’ and ‘y’ outer dimen- sions and are easily stacked for storage and manufacturing. For tray dimensions please refer to Chapter 10 of this data book. The JEDEC style shipping trays are returnable to Intel for reuse. Chap- ter 10 contains detailed information on the return addresses for the different types of shipping trays. Intel will pay all shipping costs associated with the return.
14.6.2 Tape and Reel Tape and reel handling is engineered to contain and protect surface mount components in embossed semi-conductive PVC or polystyrene carrier tapes to aid the high speed board mounting operations foundinmanyhighvolumeboardoperations. TheBGApackagesareshippedfromIntelinacarrier tape made of antistatic treated plastic. It offers exceptional strength and stability over extended time and wide temperature variations, while at the same time maintaining flexibility for use in automated equipment. The cover tape used is heat sealable, transparent, and antistatic. The loaded carrier tapes will be wound onto a plastic reel. The carrier tape dimensions meet the EIA standards. The tape and reel packaging standards offered by Intel for many of the PBGA/HL-PBGA packages meet the EIA standards, ie, EIA 481-1, 481-2, and 481-3.
However, there are some products
shipped from Intel in tape and reel that have a package orientation in the tape that is different from the EIA standards. It is advisable that the user of Intel BGA products obtain a product data sheet that shows the tape and reel shipping details to insure the correct cavity orientation is understood.