As others have mentioned it's important to place the decoupling capacitors as close to the IC pins as possible to minimize the trace inductance between the capacitor and the IC supply pins. Otherwise it defeats the purpose of the decoupling capacitor. Power pours are a great way to make connections and are perfectly acceptable in your case.
It's important, however, that the supply voltage "hits" the capacitor first and THEN goes to the IC. In other words, you should not have the power plane connect directly to the IC supply pins using thermals. Instead, have it connect to the capacitor using thermals and then have a discrete trace connecting the capacitor to the pin. So instead of your first picture, on all IC connections to decoupling capacitors you should use something like this:
Notice that this way the capacitor is "hit" first before the power can get to the IC pin. In your original image you have the pour "hitting" the IC pin directly, and the capacitor will be of little use.
UPDATE: This answer I provided is actually incorrect. It doesn't really matter if the pour connects to the IC pin directly or not. As long as the capacitor is in close proximity to the IC supply pin it will provide the benefit of decoupling. This video from EEVblog helps illustrate this point very well.