I plan on using this boost converter on an electronics project. I've got a question regarding the thermal pad on the bottom of the IC: is it okay to solder this directly to a ground plane?
A couple concerns:
The datasheet (pg 21) shows a specific ground plane connection. The thermal pad appears to land on a small section of copper that is then routed to the ground plane. Why is this?
How difficult will it be to solder if I extend the ground plane under the chip? I assume the heat will transfer much faster, thus will my design be difficult to solder (assuming I use reflow)? Refer to my current implementation below.
I understand that the thermal pad is meant to radiate heat away from the IC, so it seems like my implementation would satisfy that. For that reason however, it might be a pain to solder...