I read some of Electromagnetic Compatibilty Engineering book and it advices 4 layer stack as signal-ground-power-signal.
I allocated layer 2 as continuous ground nothing else. And since i will drive 4 motors i allocated layer 3 as lipo battery voltage's copper pour. Layer 1 and 4 are for signals and 5v, 3.3v connections that are necessary for mcu type components.
1) Since motors draw too much current 12 amps max each, would this affect ic components and can layer 3 handle this much current for 5-5cm board.Calculator says 50A with 0.7mil copper require around 340mm thickness (If i could use same pcb for power distrubiton to motors it would be nice)
2) Also i need to draw only one 0.5mm trace line for 1.8v from layer 3 is it okey?
Any advice is appriciated.