What is the increase of a two-terminal component's height after it has been soldered to a PCB in comparison to its height in an unsoldered state? Any rules of thumb?
I am interested in both reflow and hand soldering.
To understand what the question is look at the picture below:
There is some extra height added to the component's height relative to the PCB's surface due to solder under the component.
My current understanding is that during reflow soldering nearly all solder fillet is extruded from beneath the component (to the so-called areas of toe, heel and sides), video link. However, there are several hundreds (or maybe tens) microns of solder left beneath the component. If hand soldered, the increase could be greater than if reflow soldered, I guess (due to a greater amount of solder left under the component).
I am going to put several bypass capacitors beneath a chip socket (there are several areas where components lower than 0.5 mm or 1.1 mm are allowed). Thus, I need to be precise.