Alloys commonly used for electrical soldering are 60/40 Sn-Pb, which melts at 188 °C (370 °F), and 63/37 Sn-Pb used principally in electrical/electronic work. 63/37 is a eutectic alloy of these metals, which: has the lowest melting point (183 °C or 361 °F)
Having previously successful done a 'reflow' of a computer Graphics Card in a home oven in my only attempt of this kind, I am now considering doing the same for a motherboard which, while still functioning (occasionally, it will fail to start up or black screen mid use, and yes, it is the motherboard).
However with my motherboard containing a wider array of PCB components like ROMs etc and a fair bit of 'plastic' composites like ram slots (they have hundreds of traces so not practical to solder them all of in order to remove) I am more skeptical this time around.
My assumption is being PCB components that these surely adhere to some sort of temperature resistance requirements? However at 170-180 °C that I would be baking at I'm really unsure if things like capacitors, vrm's Vcontrollers and the 'plastic' bits like ram and PCI slots could handle the heat.
I'm hoping the community here can help me out on this one, as searching online mostly churns out baking laptop motherboards which lack these 'plastic' bits.
The board in question looks like this: