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I am having some troubles soldering a S-PFQP-G80 package since I get solder bridges between pins after putting it into the reflow oven and I was wondering it would make sense to decrease the pad width in the footprint. I was hoping to get a bit more space between pads and prevent bridging. Currently footprint dimensions are 0.3mmx1.45mm and the pin width is 0.17-0.27mm. This being said I guess that I would have to reassure that the pins and pads are perfectly aligned.

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The leads should get aligned when the chip is soldered, by surface tension pulling them into place. You should be able to decrease the pad width slightly. If it's only a few that are bridged you could use desolder braid.

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