I made a pcb with a QFN32 with exposed pad but I feel like I've made a mistake on the stencil, in the exposed pad area. I managed to solder it and the chip (CC1310) is programmed successfully but I'm still concerned about the stencil. The solder paste looks like a chess on the exposed pad and I don't think that this is the right pattern.
I am no expert, but it does not look bad to me. When you solder such a beast you want to be sure that all the pins will be properly soldered.
If you have less solder paste (per squared inch) for the EP than for the pins, when the solder will melt, it will try to wet the whole EP and will pull the QFN package, ensuring that all pins are close enough to their pads.
On the other hand, if you had the same amount of solder paste (or, worse, more for the EP) then you would have a chance that some pins are not properly soldered.