I have a two layer PCB. The bottom layer is mostly ground tracks and some signal tracks. The top layer is signal tracks and power tracks.
I want to pour copper ground since it helps noise issues and is free as far as I learned and for the sake of learning.
But some questions bother me from what I asked yesterday (Some questions from a first PCB design attempt) and I couldn't find any answer on net.
Here are my questions:
Which layer should I pour copper? And if this "copper pour" is on the other layer it will be connected to ground of the circuit by a via, right? And if copper pour is at the same layer it will be connected by a track? I mean at which particular point and how will the copper pour and the circuit ground will be connected? I'm totally confused.
This is a confusion between the "copper pour ground" and the "ground plane". I already have many ground tracks on one layer of the PCB. Ground pour has nothing to do with decreasing the ground tracks and making PCB manufacturing faster right? By using copper pour the ground tracks will remain the same? But by using "ground plane" instead we avoid using ground tracks and connect the ground pads directly to the ground plane by vias. Is that true and does that make the manufacturing faster?