I'm intending to reflow solder some components from Analog Devices. Since they are an LFCSP package, hand-soldering is not possible. They arrived with a warning that they are moisture sensitive (MSL3) and require baking at 125 degrees for 24 hours before reflow soldering.
My question is, as a hobbyist with limited equipment, how can I safely remove the moisture? I don't have access to a reflow oven, only a kitchen oven (and it's not feasible to cook components in that for 24 hours, I am not even sure if that would be safe).
Alternatively, is the risk of popcorning that great? I only intend to make one or two prototype boards, and I have 6 ICs so could afford to sacrifice one or two.