I am stuck on a problem while working with eagle. I have to design a pcb which has large exposed pads on the top and bottom of the PCB. I had assumed that placing a tstop layer on the pad while designing it from scratch would have done the job.
However, when the PCBs were made, pads on the bottom side of the PCB were covered with solder-mask and are now useless. I have to now remove the solder-mask from them somehow.
Can anyone explain what I did wrong here please?
The image shows the bottom side of the PCB and I had placed tstop and bstop layers on the pads while making them. But they still ended up coated with solder mask. What went wrong?