I've recently been soldering ball-grid-array parts to boards. This is relatively new to me, and there has been a few mishaps with my technique. I was just wondering how does the community perform BGA soldering? What techniques/equipment do you use to make this process more efficient and less error prone?
My technique involves using a Hakko FR-830 Preheater to do the work. I use an old board holder to hold my board in place, and then I apply some solder to the board using a syringe (ChipQuik SMD291AX). My part is a 6x6 BGA array, with the pads 1mm apart from each other in a square grid. Once I place the solder onto the pads, I slowly put the part onto the pads, aligned as close as possible. Then, once it's ready, I turn on the preheater through its temperatures from 150-300 degrees Celcius at 50 degree intervals for about a minute and a half at each temperature. The apparatus is not enclosed, so I put a piece of metal over my board holder so that the top of my PCB board is not exposed to open air.
My process is not exactly ideal, but thus far, it works alright. However, I noticed that the solder doesn't seem like it really 'melted'. I think that this might be because of my methods, and running a hot air gun on the sides doesn't really help much. Any tips or suggestions? This is all done in-house, and I have to do this by myself, so learning how to do it better would be helpful.