I have a product that will be subjected to reliability testing (random vibration and thermal shock) and I need to design a footprint for an SMT power inductor that will give the best mechanical strength to resist damage during vibration testing. I've looked through the IPC 7351 standard but I cant find anything that talks about how different pad size (resulting in different fillet shape) will affect the mechanical strength of the solder joint. The part I am working with is Murata LQH3NPN1R0MMEL. It has a mass of approximately 0.05 grams.
Does anyone have a method for calculating a land pattern for optimal mechanical strength?