I'm trying to snowman some BGA pads in eagle but not coming across any real way to do it. Theres the teardrop.ulp but for whatever reason it doesn't add any teardrops to my pads.
The existing "teardrop" scripts don't work because they only process vias and pads, whereas your BGA "pads" are actually "SMDs", which EAGLE handles differently.
I've been playing with this recently, starting with the teardrop ulp, refactoring and having it draw a single fat short wire instead of the "diamond" shape that it used for teardrops. It's not quite complete, (the 'undo' feature doesn't work, it doesn't handle non-round SMDs or elongated pads, and the documentation needs updated, but it might be worth a try if you're still interested...
I haven't been able to find a script for this but I intend on writing one depending on how often I might have to do this.
For now a manual method would involve drawing a circle with width 0 (to create a solid pad) on your top layer with a radius a little bit smaller than your pad. Copy and paste as needed across your design.
DRC will fail with Overlap errors with this method however