I recieved samples of AD7175-2 and AD5684R with an instruction:
If these samples are to be subjected to solder reflow or high temperature process, they must be baked for 24 hours at 125°C prior board mount. Failure to comply may result in crack and/or delamination of critical surfaces within the package.
Is it done in a reflow oven? Otherwise how?
I am confused because Elektor qs-5188C reflow oven in our lab seems to lack an option, that would let it run for such a long time.