When I'm handling an IC that is sensitive to ESD that comes packaged in an antistatic bag, do I nullify my ESD protection procedures if I peel back the cut-tape and dump out the IC into a plastic cup instead of dumping it directly onto the surface of my ESD mat? Do I need to dump the IC out directly onto the surface of my ESD mat for it to equalize its static charge with me, my mat, and my soldering iron?
Assuming that the answer to the above is "yes", then does it make a difference if the pins of the IC touch the mat or not? I'm guessing that if you dump an IC onto a ESD mat and the pins never touch, then the internal conduction pathways of the IC are still statically charged relative to my local earth ground, and that when I plop it onto my PCB for soldering the ground plane of the PCB has enough stray capacitance to allow an ESD discharge from the IC to the ground plane of the PCB (which has been earth-ground equalized prior to this by way of me touching an exposed ground plane pin ).
Is this a thing? Do I need to worry about the stray capacitance of the PCB ground plane and differential static voltage between the PCB ground plane and IC being placed on it?