I'm building a design involving Toshiba's TB6600 chip which has an unusal HZIP25-P-1.00F package. I've seen implementations where folks have bent the pins manually and soldered them horizontally such that a heatsink can be bolted directly onto them.
However, I did not want to do this. Instead, I thought of attaching an aluminum right angle bracket to a normally mounted chip (vertical). One side of the right angle bracket would be touching the chip's heatsink area while the other side will be touching an exposed pad on the PCB. This same exposed pad is present on the bottom copper side as well and is connected with the top copper using thermal vias. A large finned heat sink is then fitted onto the back side of the PCB and connected to this bottom copper side.
I haven't gotten around to doing calculations on this yet but any thoughts on if this is a good idea?