This is my first layout connecting two BGAs: DDR3 SDRAM and a Zynq SoC. The design has 4 layers and I'm using Kicad. So far I've understood the following:
1. Focus on signal groups, i.e. ADDR, CTRL, CMD and data bytes. 2. Use the same layer transitions (VIAs) in each group for convenient length/delay control.
General things I keep in mind is to have the traces somewhat short (~25 mm). Looking at various tutorials this seems to be a trivial matter for experienced PCB designers. I do this so that I don't have to worry too much about impedance control.
To my not so experienced eyes, this seems like a complete chaos and I have many more pin connections to go. On top of this, all traces will have to be length matched which will introduce even more challenges.
My humble question is: can someone give me a few tips on how to proceed with this?
Is layer increasing the way to go? And/or a larger distance between the components?
To me it seems like Xilinx could've picked better locations for their DDR3 pins in order to simplify the layout work.
DDR3 SDRAM datasheet - IS43TR16640B-125JBLI
Zynq-7000 Pkg Pinout specs - XC7Z010CLG400