After having spent 4 hours to hot air solder, multimeter probe, apply flux around the sort circuiting pads, re- hot air, re- probe and finally apply wick & iron to get rid of those shorts I am now concerned with possibly having overwicked them. Can't tell for sure if there is pin to pad connectivity and wouldn't know how to test for it. Also wouldn't want to go on soldering the rest of the board only to find out at the end that my no lead packaged chip is not working.
Is there any way I could test this connectivity for a LGA package ? it does not expose its pins on the side, it only has bottom pins. I don't know if the multimeter probes are touching the solder joint or just the bare solderless pads underneath.
Tried the resistance to GND measuring method from @Some Hardware Guy answer. My joints are a wreck... Aside from that, I can understand cases 1 and 4 below, but how about 2 and 3 ?
- DMM reading of 1.4 M - probably for the healthy solder joint
- DMM reading of 1.0 M - how so ?
- DMM reading all over the place, or slowly decrementing, or slowly incrementing
- DMM reading out of range - probably no contact between the pin and pad