I am working on a project for a client that involves developing a reliability test fixture that will be used for stressing the end test device (DUT). The test fixture is a PCB which has linear power supplies and some relatively low speed communications busses (I2C, SPI, etc) and will be subjected to the same temperature and humidity stresses as the DUT. We're planning to suggest discarding the test fixture board as that would be more cost effective and the customer is ok with this.
As part of the deliverables, we'll have to provide documentation that gives an estimate of the reliability of the fixture, currently we're running a simple heat soak test as per the DUT test spec on some known good DUTs provided by the customer and we are exceeding that spec (300hrs at 70℃ and 85% RH)
Here are the questions I have:
- Any pointers on how we could run more tests to gain further confidence on our test fixture design? we would like to explore the possibility of using the fixture for multiple test cycles?
- What metrics can we use? would MTBF be a good measure?
- Any suggestions for good references that could help me with understanding reliability for electronics better, I'm quite new to this domain and would like to learn more?