I am developing a new open source device which consists of several functionalities. My plan is to get it printed from a PCB manufacturing company and get it assembled from the same company. I have discussed with several people and came up with the following options. Please note that the device has 150+ components and 350+ nets.
- Develop the PCB as a 4 layer PCB and components on both sides. (Size : Arduino Uno)
I have tried obtaining a quotation from seeedstudio and for 100 boards, total cost was estimated as USD 4994.26
- Develop the PCB as 2 layer PCB and components on one side. (Size : Arduino Mega)
- Develop the PCE as 2 layer PCB and components on both sides. (Size : Arduino Mega)
For the above two cases, it was quoted as USD 4878.23
So my question is this; In production, if we place components on both sides, does it have a major impact in the cost and the process? (As the boards need to be turned to solder the other side etc.)
I am adding more details about the PCB. The PCB is a device with a 16 bit PIC microcontroller (TQFP44) which acts as the main processing unit. All the components are SMD. It has a UART bridge(MCP2200) and a couple of OpAmps (SOIC8) to generate sine waves, square waves and a ADC chip with a few voltage doublers and inverters to provide functionalities such as a 4 channel oscilloscope, 4 channel logic analyzer and expansion slot for an ESP chip. The device can be connected to a computer via a USB cable and with the use of a desktop application users can interact with the device.