Thanks to @TomCarpenter advises (and my research) I have found information that I was looking for.
First (and primary) relevant document is a TI wiki page that provides tables at the bottom pf this answer. According to those tables for BGA with pitch of 0.8mm and ball diameter 0.5mm the following applies:
- Nominal landing diameter (copper pad size) = 0.4mm ± 0.05mm
- via copper (outer) diameter = 18mil (~0.45mm)
- via drill size = 10-8mil (~0.254-0.2mm)
- copper trace width = 4-5mil (~0.1-0.127mm)
- Clearance width = 4mil (~0.1mm)
Second found document produced by IPC supposedly has more detailed information on these number, however the document is paywalled and therefore is N/A.
Third document that was found comes from JEDEC and provides very detailed information on each measure that is seen on dimensions picture in the question. In this document in table 4.27-2 it provides a b1 dimension for ball diameter 0.50mm equal 0.35mm. According to description this is the size of opening in resistant layer that would expose copper pad for soldering with the ball (or in other words this is the minimum size of the copper pad).
Since JEDEC document provided minimum size but no upper boundary, I would consider using numbers from TI document. Using those sizes in Eagle package editor and enabling Cream and Stop on the pads I get following picture:
Which looks like normal routing with default values of stop bounds should work just fine. Worth noting that with these sizes default value of stop bounds is equal to the one recommended by TI (4mil or 0.1mm).
Relevant tables from TI page:
IPC-7351A for NSMD Pads
Nominal Land Nominal Land
Ball Reduction Pattern Land Variation
Diameter Density Diameter
0.75 25% A 0.55 0.60-0.50
0.65 25% A 0.50 0.55-0.45
0.6 25% A 0.45 0.50-0.40
0.55 25% A 0.40 0.45-0.35
0.5 20% B 0.40 0.45-0.35
0.45 20% B 0.35 0.40-0.30
0.4 20% B 0.30 0.35-0.25
0.35 20% B 0.30 0.35-0.25
0.3 20% B 0.25 0.25-0.20
0.25 20% B 0.20 0.20-0.17
0.2 15% C 0.17 0.20-0.14
0.17 15% C 0.15 0.18-0.12
0.15 15% C 0.13 0.15-0.10
PCB Typical Feature Sizes For Standard (non-Via Channel) BGA Arrays
Ball Via Via Hole Trace Clearance Micro
Pitch Diameter Size Size Vias?
0.8mm pitch 18 mil 10-8 mil 4-5 mil 4 mil No
0.65mm pitch 16 mil* 8 mil* 4 mil* 4 mil* No
12 mil 6 mil 4 mil 4 mil Yes
0.5mm pitch 10 mil 5 mil 3 mil 3 mil Yes
0.4mm pitch 10-8 mil 5-4 mil 3 mil 3 mil Yes
*16 mil diameter/8 mil hole vias are only possible if done in
a creative way that puts traces only in between every other via.
In other words, 16/8 vias, when placed between the balls, will
move enough to allow one 4 mil trace per pair, but not one 4 mil
trace per via, so for some designs like the DM365 and DM355,
16/8 mil vias should be possible in your application since there
are some areas to place vias in the array. However for Freon,
since it's a full array, it is not possible to use 16/8 vias
unless only every other pin is used (not likely). 16/8 vias are
uncommon in the PCB fab world, but some companies can do them
without micro vias.