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I thought of an idea where i have a pcb with a soc on it, and a seperate one with the DDR3 memory that can snap into each other. This way i can replace or debug specefic parts of the system and have e.g. a how swappable soc in my system. So my question is: What is the maximum distance i can place DDR3 chips away from the SoC(so it still works) when all traces are length matched between each other?(Using 2,4 and 6 layer boards?)

Thanks

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    \$\begingroup\$ The connector will be non-trivial. Use a standard DIMM and connector. Then read the documentation for those. \$\endgroup\$ – Neil_UK Feb 5 '18 at 13:53
  • \$\begingroup\$ But don't desktop dimms use some other technique to mix all chips?Or is that not what you mean/am i wrong? \$\endgroup\$ – appmaker1358 Feb 5 '18 at 14:01
  • \$\begingroup\$ Do you mean "hot-swappable SoC"? How do you imagine that will work? \$\endgroup\$ – Dave Tweed Feb 5 '18 at 14:13
  • \$\begingroup\$ I mean having Ram, SoC(with power and such),storage, and io as a seperate board that connects to each other. This way i can design a new board with soc, without redesigning the ram,storage, and io part. \$\endgroup\$ – appmaker1358 Feb 5 '18 at 14:14
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    \$\begingroup\$ I think you'll find most desktop motherboards have voltage regulators on board. \$\endgroup\$ – Finbarr Feb 5 '18 at 15:27

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