In statistics as well in Contract Manufacturing DFM design for Manufacturability the probability of defects in soldering increases with the degree of mismatch to IPC footprints for the desired soldering method < RElow vs Wave solder has different footprints and layout orientation recommendations.
In solder reflow, and contract manufacturing, 99% of the defects are related to poor solder and many or most of these are design related to board layout.
Without details on your actual part, and pad design , it is impossible to assess.
I advise you to read about IPC solder pads and Mfg's recommendations and/or consult with EMS builder for DFM analysis or use your mentor and software to do the same.
DFM= Design for Manufacturability.
DFT= design for Testability
DFC= Design for Cost
DFX = Design for Excellence. ( all of above)