I am doing some assembly on a PCB which has a variety of SMD components. I accidentally got a little crazy with some paste on a large GND pad for an ESP32 component. I went to place the component on top and melt the solder, it appears to have oozed out of 2 of the vias located near the GND pad. I've checked with my multimeter and it appears the vias did not get shorted to ground, is that possible?
Am I safe to continue the assembly without desoldering the large SMD component (which I've failed to do so far) and removing the solder from the vias?