Does somebody know how I can detect a layer of IGBT modules in which a thermal failure, e.g., voids, cracks, delaminations of solder joints, has taken place? We know there is fatigue in both solder joints of wire-bond IGBT power modules, one joint is between chip and DBC and another joint is between DBC and baseplate. When operating IGBT module, how can I find which joint is degraded? Is there a specific technique to detect it in practice?

  • \$\begingroup\$ x-rays are often used to check for defects under BGA packages. But I don't think that would extend to your needs. \$\endgroup\$ – Hearth May 10 '18 at 1:42
  • \$\begingroup\$ This is not an answer either, but shorted MOSFET's and IGBT's will have a gate voltage present if the drain has voltage. The insides have fused into a lump. \$\endgroup\$ – Sparky256 May 10 '18 at 1:55
  • \$\begingroup\$ Is this a 3 phase module ? What are the symptoms? Do you know how to measure Rth? \$\endgroup\$ – Sunnyskyguy EE75 May 10 '18 at 2:09
  • \$\begingroup\$ @Felthry, acoustic microscopy too. \$\endgroup\$ – Nick Alexeev May 10 '18 at 2:11
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    \$\begingroup\$ When you tried Google for [failure analysis IGBT], what did you find out? Vote to close as "too broad" \$\endgroup\$ – Ale..chenski May 10 '18 at 2:23

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