I recently downloaded a component's footprint and it comes with a peculiar solder paste pattern (see picture attached - solder paste is in gray). Until now I have just defined the solder paste to be the same size as the pad, but know I am wondering if this kind of pattern has a purpose, maybe for better thermal relief?
Should I use a full pad solder paste pattern, or there is any benefit in using something like this one?
Also, I have seen that some people put vias in the pad for thermal relief, but what kind of vias? Through hole vias to a bottom ground plane... blind vias to a inner ground plane? Is it really necessary?