There are many similar questions but I didn't really find the answer I want.
I have many 2-layer boards for analogue-audio-stuff. I use both layers for routing and I have ground fills on just one layer. (mostly on bottom layer). Well it works this way but..
Why shouldn't I fill also the other layer with ground copper and connect them using multiple small stitches/vias? That would reduce the impedance between some grounding components which were connected through narrow ground paths on one layer.
Do you see any reasons not to fill the both layers with ground?