I am designing a board based on RN2483. As i have none experience on RF design i am following the guidelines from microchip's datasheet as the pictures bellow. enter image description here

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So my question is about the many vias. I have seen another RF designs based on Semtech's sx1276, which is used in RN2483, and i observe the same vias pattern. Moreover, on an another sx1276 design under the IC (on the bottom layer) there is a similarly via pattern creating a square from vias as the dimensions of the IC.

What is the purpose/gain of them?

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    \$\begingroup\$ Go google "stitching vias and RF". \$\endgroup\$ – Andy aka Jun 18 '18 at 12:34
  • \$\begingroup\$ Many thanks for your comment. Do you know if there is a problem if i use common via instead of stitching one? I read the definition of stitching vias and their purpose on rf designs and i think it would not be any differences. \$\endgroup\$ – alexisicte Jun 19 '18 at 7:13

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