I was visually inspecting a board that had functional problems, and I have noticed a strange pattern in the pads surrounding the IC.
Upon electrical inspection, there are two pads that are shorted out: the second and third one on the horizontal part right to left.
This is a prototype board and there was lots of debugging and probing the board to solve some problems.
Does it seem to be consequence of mechanical damage, such as external probing with pointy tip, or a defect from the reflow process?
Could just a touch up with the iron reshape the soldering joint? I am afraid the IC pins are bent with the surrounding solder, which would make the repair difficult.