Having no past experience on RF design I have recently been taught that placing stitching vias is a good practice. Reading the "definition" of stitching vias I am not sure that I can distinguish stitching vias from common vias. The definition I have read is from Altium:
Via stitching is a technique used to tie together larger copper areas on different layers, in effect creating a strong vertical connection through the board structure, helping maintain a low impedance and short return loops. Via stitching can also be used to tie areas of copper that might otherwise be isolated from their net, to that net.
Is there a difference in functionality between the two types of vias?
Thank you both for the replies. You are very helpful. My design is based on RN2483 package which includes a MCU and a RF IC. If you check RN's bottom layer it is obvious (or I make a guess) where the RF IC is located because there are stitching vias.
On my PCB should I place similar vias?
Here is my current layout:
Now all the vias are connected to GND on top layer. Ignore the one that is overlapping the RFH trace. Now I will add a ground plane to bottom layer as well.
I am open to suggestions/corrections because as I stated it is my first RF design and I lack knowledge.