I'm making a prototype that uses, among other things, a bluetooth mcu connected to a 2.4GHz chip antenna. Its using a 4 layer PCB, and I'm thinking about what to do with the feedline, whether it should be buried on one of the middle layers, or left on the top layer.
I've been using this website (https://www.eeweb.com/tools/microstrip-impedance) to look at the various calculations. To get a 50 ohm line, it looks like the top layer would need to be 13 mil wide, and the buried one would need to be 7 mil. Both of these would be fine.
Is there an argument to be made for burying this feedline? Is that a standard thing done in industry (to reduce unwanted radiation, for example)?