I am small scale manufacturing PCB's I designed for high power actuator and LED control. It is 6"x8", 2 ounce copper and large power and ground planes, with no thermal reliefs. It has a section at one edge that is all SMD components, a large copper through hole buss bar that spans the entire length, and several through hole MOSFETs, and several through hole connectors.
So I have make 10 boards so far, and will be making around 5 a week. I use a hot plate for the SMDs, and that works great.
For the TH components, I use a hot air reflow gun, and use a soldering iron. This is not ideal. I have to put a lot of heat on it, and I struggle with cold solder joints if I don't get enough heat on it.
So, I am content with my method for the SMDs, as with a solder stencil, I am able to solder them quickly and quite consistent. For the TH components, I need a new method. I have a few options I've considered:
Use a IR preheater that goes under the board to heat the planes.
Same as 1, but with a forced air convection heater.
Get a larger spread nozzle for my hot air gun, and an articulating arm that can hold it to help heat more evenly.
Budget is whatever it takes, but I would like to stay under $1000 if possible. Let me know what you think, and if there are options I'm forgetting.
EDIT: I want to do this as correctly as can be done without large scale procedures, these are high power expensive boards, and don't want to take risks with how I heat it, like I feel like I may be doing now.