I have a four layer board. The stack is divided as follows:
Layer 1: Signal
Layer 2: GND
Layer 3: Power
Layer 4: Signal
I have SMD components such as an SMD fuse, but the Power layer is in Layer 3.
What is the best way to properly achieve this connection?
Do I need to place a copper polygon pour on Layer 1 as well as Layer 3 and then connect them using vias?
Or because it is a small connection I can get away with just using a top copper pour?