# How to properly connect SMD component to inner layer

I have a four layer board. The stack is divided as follows:  Layer 1: Signal Layer 2: GND Layer 3: Power Layer 4: Signal

I have SMD components such as an SMD fuse, but the Power layer is in Layer 3.

What is the best way to properly achieve this connection?

Do I need to place a copper polygon pour on Layer 1 as well as Layer 3 and then connect them using vias?

Or because it is a small connection I can get away with just using a top copper pour?

• Using a via - they take signals through the board. – Tom Carpenter Oct 11 '18 at 10:00
• So two copper pours, one on Layer 1 and the other one on Layer 3 and then using via's to connect them? – ll ll Oct 11 '18 at 10:02
• Copper pours or traces. You can use multiple vias if you want more current handling capacity. – Tom Carpenter Oct 11 '18 at 10:21
• But can I then use a normal via that connects Layer 1 all the way to Layer 4 and then use only copper pours on Layer 1 and Layer 3, will that leave Layer 2 and Layer 4 alone (because now I don't have the option to place a Blind Via)? – ll ll Oct 11 '18 at 11:00
• Correct. In eagle a 1-4 via allows connection to all layers. However it will only connect to planes belonging to its own signal. Planes on the inner layers will behave just like planes on the outer layers - they will avoid anything that they are not on the same net as. – Tom Carpenter Oct 11 '18 at 11:03