I am designing a 6-layer board, with stackup like this:
1-TOP slow North/South
2-GND
3-Signal high speed East/West
4-Signal high speed North/South
5-VDD
6-Bottom slow East/West
PCB plane spacing is:
Layer1
- 4 mil -
Layer2
- 20 mil -
Layer3
- 4 mil -
Layer4
- 20 mil -
Layer5
- 4 mil -
Layer6
I'd like to take advantage of interplane capacitance and pour alternating GND and VDD pours. However, I am not sure how this will work in regards to maintaining a proper reference plane, as the reference plane will have to switch when moving from layer 3 to 4 for example, because the layer 3 pour will block the intial layer 2 reference.
Here is an example I threw together. Brown is GND, Blue is VDD, and Pink is the signal in question
Layer 1 VDD
Layer 2 GND
Layer 3 VDD
Layer 4 GND
Layer 5 VDD
Layer 6 GND
Non poured view
Is this a bad idea, or do I need to stitch vias everywhere to do this? Or will interplane capacitance take care of plane switching?
The circuits on my board I am concerned about are ethernet RMII, and QSPI signals clocked at 50mhz.