I'm designing a 4 layer PCB and I know that the standard stack-up is
(GND and VCC can be switched depending on the layer with more signals)
The problem is, I don't really want to connect all ground pins through vias, there are just too many of them. Maybe because I'm not used to 4 layer PCBs, anyway, I've read a tip by Henry W. Ott about a different stack-up
(Where the power is being routed with wide traces on the signal planes.)
According to him, this is the best stack-up possible with a four-layer PCB, for the following reasons:
- Signal layers are adjacent to ground planes.
- Signal layers are tightly coupled (close) to their adjacent planes.
- The ground planes can act as shields for the inner signal layers. (I think this requires stitching.)
- Multiple ground planes lower the ground (reference plane) impedance of the board and reduce the common-mode radiation. (I don't really understand this one.)
One problem is cross-talk, but I really don't have any signals in the third layer, so I don't think that cross-talk will be an issue with this stack-up. Am I correct in my assumption?
Note: The highest frequency is 48MHz and there's a WiFi module on the board, too.