I'm designing a 4 layer PCB and I know that the standard stack-up is
(GND and VCC can be switched depending on the layer with more signals)
The problem is, I don't really want to connect all ground pins through vias, there are just too many of them ! maybe because I'm not used to 4 layer PCBs, anyway, I've read a tip by Henry W. Ott about a different stack-up
(Where the power is being routed with wide traces on the signal planes)
According to him, this is the best stack-up possible with a four-layer PCB, for the following reasons:
1.Signal layers are adjacent to ground planes.
2.Signal layers are tightly coupled (close) to their adjacent planes.
3.The ground planes can act as shields for the inner signal layers. (I think this requires stitching ??)
4.Multiple ground planes lower the ground (reference plane) impedance of the board and reduce the common-mode radiation. (don't really understand this one)
One problem is cross-talk, but I really don't have any signals in the third layer, so I don't think that corss-talk will be an issue with this stack-up,am I correct in my assumption ?
Note: The highest frequency is 48MHz, there's a wifi module on the board too.