I'm going to assemble a prototype PCB which have components on both sides. I have access to a reflow oven with profiling control, solder paste and stencils (from OSH-Park)
In the reflow process for the second side, I expect that small components will stick to the board even in the melting temperature, as mentioned in this answer.
But I'm worried about a big component that I used on the board. SEDC-10-63+ is a 3cmx2cmx1cm coupler with weight of 7.3g. I have two of them exactly packed back to back on the layout. Because of the exposed pad at the bottom of package I cannot use a heat gun nor the hand soldering iron to solder the part. My question is that does the bottom part will fall off because of it's size or I will going to get a successful soldering and I shouldn't be concerned so much.
I know that I can use a low-temperature solder paste like this one, or using SMD Epoxy Adhesive but I'm more interested in hearing the limitation of simple reflow process about what packages can and what can't soldered using this method (with exactly dimensions and weight they have successfully/unsuccessfully assembled)