this is more of a 'I have no ideas how to route this part' than 'I don't how to technically route this part'. Or maybe both. Basically I have no ideas how to route and what to do here.
R35 cant access those pins which is a big problem. Any ideas?
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\$\begingroup\$ Vias? Does it have to be single layer? Can you route through the pads on the top layer? \$\endgroup\$ – Drew Fowler Jan 24 at 18:25
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\$\begingroup\$ Multi layer. Vias are way larger than the actual pads, so they would be bigger than the pads. The third question I dont understand, sorry. \$\endgroup\$ – Ben Cruel Jan 24 at 18:45
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1\$\begingroup\$ What is the pitch of the IC? What is the diameter of the ball pads? \$\endgroup\$ – user110971 Jan 24 at 19:25
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\$\begingroup\$ @Ben, Drew's third question is asking can't you just run a trace between two balls to connect to the inner pads. You haven't shared the pad diameters or spacing, so we don't know whether this is possible or not. \$\endgroup\$ – The Photon Jan 24 at 19:56
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The way this is typically done is with micro vias (via less than 6 mil in diameter), this will also add manufacturing cost. Compare the manufacturing cost to the cost of the package (if there are different options go with a different package).
You'll need to add another via size in the via template and change the DRC rules if you use them.
Source: https://e2e.ti.com/support/microcontrollers/msp430/f/166/t/649693
answered Jan 24 at 18:59
