I'm designing a 150Amp controlled rectifier and I'd like to know how to distribute the current using a multilayer design.
Currently, I have a 4 layer design containing: Top Layer: 6oz, Vdc+ and Vdc- Internal Layer 1: 1 oz, Vcc and some control traces. Internal Layer 2: 1 oz, GND and some control traces. Top Layer: 6oz, Vdc+ and Vdc-
I have used online calculators to know the minimum width of the traces, and for physical restrictions, there are some cases that I'm close to the minimum. Then, I have to go to a thicker board (which is not an option because our provider works up to 6oz). Then, I was thinking of using the internal planes to distribute some power current too:
Top Layer: 6oz, Vdc+ and Vdc- Internal Layer 1: 1 oz, Vdc+ and Vdc-, Vcc and some control traces. Internal Layer 2: 1 oz, Vdc+ and Vdc-, GND and some control traces. Top Layer: 6oz, Vdc+ and Vdc-
Vdc+ and Vdc- will be connected in the four layers through capacitors-IGBTs vias. The internal planes will have a bigger resistance but lower current, but I'm not sure about the heat dissipation and/or other technical problems that might arise.
I'd like to know if some of you have some experience in this subject and can provide me with the pros and cons and/or providing some references that deal with similar problems...