I am working on a 2 layer board and the PCB will be a double sided job. Some components on the top layer will have exact mirrors on the bottom right under them. My question is, for SMD components, can I just connect those pads with a via right in the center of the pads?
Does this affect electrical performance or production/assembly in any shape or form?
The reason: The bottom layer is a copper pour for ground and I have pads that belong to
GND net so why not?
Please see the picture below (for demonstration porpuses I have moved the top component a little bit higher).
P.S. The components are TVS diodes (SM8J36CA). But my qustion is more general and is about wherever the pad size allows hosting a via in its center!