# Connecting top and bottom SMD component pads using via

I am working on a 2 layer board and the PCB will be a double sided job. Some components on the top layer will have exact mirrors on the bottom right under them. My question is, for SMD components, can I just connect those pads with a via right in the center of the pads?

Does this affect electrical performance or production/assembly in any shape or form?

The reason: The bottom layer is a copper pour for ground and I have pads that belong to GND net so why not?

Please see the picture below (for demonstration porpuses I have moved the top component a little bit higher).

P.S. The components are TVS diodes (SM8J36CA). But my qustion is more general and is about wherever the pad size allows hosting a via in its center!

• Talk to whoever is doing your assembly. Vias-in-pads generally wick solder away from the joint, causing reliability issues. – Dave Tweed Mar 14 at 20:44
• I wouldn't try it due to issues that can arise. They do this on BGAs where space is at a premium and it's called "via-in-pad" but they take special measures to make sure it works. – Toor Mar 14 at 20:44
• It's possible, but not recommended. If you're hand-assembling them, it should be okay, if a little harder to keep together. If this is for automated assembly, don't do it unless you really have no other option. – Hearth Mar 14 at 20:57