This is my first PCB design and I'm struggling with proper copper pour usage.
I would like to copper pour VCC and GND.
From what I understand, a copper pour will net multilayer plated through holes automatically. When properly done, it is helpful for most boards. (I just love the fact that I can connect VCC and GND without traces)
Please help me understand the best placement of VCC and GND copper pours in 4-layer PCB.
I think, Top (GND), layer2 (VCC), layer3 (GND), layer4 (GND)?
Added Info: All components on top layer, 5MHz using SPI w/ Mode0, board is large (35cm X 35cm), 4 layers.