The data you are refering to are the Product dimensions. You should design your pad layout such that a component with minimum dimensions as well as a component with maximum dimensions will both fit, so both can always be decently mounted to the PCB.
For machine Placement/Oven soldering I would just use the the Recommended Solder Pad Layout as given in the datasheet.
The picture right of the recommended Pad Layout is from my own (component) editor. Red are the pads, yellow the silk screen with the component drawn in the typical dimensions.
For this question, I added the component's minimum and maximum dimensions in grey as well, so you can see how both still fit into the recommended solder pad layout.
For manual soldering I would recommend to keep A and L as provided, but increase B.
Don't forget to apply the sensing traces as shown in your PCB editor. The Kelvin connection is required for a good measurement.
In the datasheet, the letters A, B and C for the Recommended Solder Pad Layout differ (in meaning) from the A, B and C used for Product dimensions.
I updated the right picture, so you can see the pads of the component are still enclosed by the land pattern, even for the minimum product dimensions. L should therefore be 1.3 mm as recommended.