I am using an SHTC3 temp and humid sensor to send readings using I2C lines to the MCU.
Based on the datasheet for SHTC3 to make sure the sensor is reading ambient temp without the interference of the heat coming from traces and planes that connect to the MCU and other heat producing ICs, it is recommended to limit the trace lines to the MCU and not to have copper filling under the SHTC3 chip. As well as adding an enclosure shield to prevent heat radiation.
When adding a decoupling cap on the power lines to the chip, there are the traces that need to connect to the planes and that requires a trace spacing as seen below. Best way is to increase the trace width to the cap to lower impedance to the cap since there is no copper filling under or around the cap. Does this seem accurate?
Here is the schematics:
I would appreciate any feedback you all could provide. Thank you so much!!