I' m following this guide; concretelly 3 and 4 chapters for High Voltage (HV) PCB design:
The fact is that I have read interesting ways to avoid arcs and coronas between to high voltage conductors.
I have found here some of them as for example:
- Field gradient rings
- Routed Slots
- Inert Insulators
- Cover Coats for solder mask with Kapton
- Dielectric strength sheets material
- Rounded copper shapes
I must to design a board with some HV relays, 8 points x 2 relays. Every relay will connect some of these points to a source positive terminal. This High voltage will arrive to the every relay by a wire from an industrial HV source.
HV source is an external device that brings energy to the board relays towards H and L terminals:
Although the board or relays will handle a max of 10KV the application only will need a few mA from the HV source.
Board will only have relays, connectors and not too much elements apart of these; maybe some diode, decoupling C if needed or even some R (depends on relay specs). Relays coils will be fed by low voltage (12V or 24V).
My question here are:
- Will I really have arc and coronas problems to avoid with this little current consumption: few mA (5, 10, etc)?
- Will I really need to use those techniques: upper dielectric strength material for the sheet, routed slots to prevent carbonation of board, Kapton Cover Coats for increasing the dielectric strength of the board, etc.. or can I still using low voltage PCB design materials and techniques?
- At page 14 autor says that "corona and leakage current from the field must be calculated o experimented with" when designing pcb. How can I calculate corona and current leakage effects? So in case I get them, how must I use them?