Between epoxy resin molded vs hermetically sealed metal can packaging for photodiodes and LEDs are there any relevant functional differences I should be aware of when selecting between otherwise seemingly identical photodiodes or LEDs?
The can offers potential flexibility for lens/filter options while the molded packaging is obviously lower cost. It seems to be a toss up which is actually more mechanically rugged and environmentally stable since one case is entombing/encapsulating in a more permeable material while another is being placed inside an impermeable material. I guess the metal can packaging would also handle higher temperature. Are these the only significant differences?
LED Example: https://dammedia.osram.info/media/resource/hires/osram-dam-5580407/SFH%204550_EN.pdf
https://dammedia.osram.info/media/resource/hires/osram-dam-5723400/SFH%204851_EN.pdf
Photodiode Example (not quite as identical as the LED example):
https://www.marktechopto.com/pdf/products/datasheet/MTD5010N_2011_07_20.pdf
https://dammedia.osram.info/media/resource/hires/osram-dam-5488355/SFH%20213_EN.pdf