I am designing a 4 layer board in which I HAVE to use blind and buried vias. This is a very dense board with (SOLID COPPER ON LAYER 4, No exceptions )
I am planning to use 1.) 1-2 microvia and 2-3 Buried vias. 2.) 1-2 and 2-3 Stacked microvias. ,
So Can you suggest whether I could go with the first configuration or I should switch to the 2nd configuration keeping cost in mind.Which configuration is cheaper.
Keep in mind that this is not HDI PCB just a mixed signal board of analog and digital
I should mention that PCB Is 0.4mm thickness. So more then 4 layers is not possible